Reflow soldering

TAMURA

TNR15-225LH


Reflow soldering
+
  • Reflow soldering

Product Video

Product Overview

Product Features

· The world's first ultra-compact lead-free device response unit;

· Although ultra-small in size, it can create a temperature profile HAT;

· Composed of 5 heating zones;

· Because of its minimal size, it is easy to configure and layout in factories;

· Achieves power saving and nitrogen (N2) conservation;

· Most suitable for multi-variety, small batch production.

Product Specifications

Standard Features
· Touchscreen Control

· Activated Carbon Regeneration Device

· Flux Recovery Machine

· Substrate Stagnation Alarm

· Independent Control of Fan Inverter

Options

· UPS Uninterruptible Power Supply

· Water-cooled Chiller Unit

· Oxygen Concentration Controller

· Handling Substrate Unloading

· Heater Disconnection Alarm

· Area Sensor

 

Target Substrate MAX. W150×L150 (mm)
MIN. W50×L50 (mm)
Component Height Upper 10,15,20,25mm
Lower 10,15,20,25mm
Worktable Base 3mm
N2 Gas Supply Source 99.99% or higher 0.4~0.7Mpa
150NL/min or more
Substrate Transport Height (Rolling Line) 900±20mm
Input Power AC200V-50/60Hz-3φ 21kVA 61A
Overall Dimensions W1210×L2200※1×H1370※2 (mm)
Total Weight Approx. 600kg
Transport Speed 0.1~0.7m/min

Product Advantages

Application Areas

Recommended Products

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