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Product Overview
Product Features
The RDT-250II features a compact footprint and upper heater zone control, allowing for heat distribution to suit the installation layout of PC board components.
Product Specifications
| Target substrate size | Size: 250W x 330L mm or less, or height of carrier rod lower limit: lower 5mm upper 28mm - upper limit: lower 31mm upper 2mm * Size measured from the bottom of the substrate |
| Device size | 778W x 863D x 1417H mm (excluding signal tower) |
| Heating system | Top: Combination of far infrared and hot air Bottom: Far infrared |
| Cooling system | External gas (nitrogen or air) introduction system (linked with exhaust damper), equipped with cooling flow control valve |
| Power supply | Three-phase, 200V, 50/60Hz, 17.8kW / Line current: approx. 51A (maximum heating power) (With added hot air heater: 23.8kW / Line current: approx. 68A (maximum heating power) |
| External gas | 0.3 ~ 0.5MPa, maximum 300L/min, including pressure-compensated flow control valve |
| Oxygen concentration inside the furnace (When using nitrogen) | Minimum 100ppm |
| PC board tray | Network system or carrier system (optional according to requirements) |
| Top heating | Far infrared & hot air heater: approx. 15kW (500W x 30 units) ※ Deviation setting can be made for reference modules. Hot air heater: 2kW×2 + 1kW×2 (optional) |
| Bottom heating | Far infrared heater: approx. 2.4kW (400W×6) |
| Temperature accuracy | Room temperature to 80℃: ±3℃ 80℃ ~ 330℃: ±2℃ 300℃ ~ 400℃: ±3℃ |
| Measurement temperature | Room temperature to 400℃ |
| Measurement points No. | 6 points (automatic mode: 7 points) |
| Nitrogen supply function | Flow control valve: 200L/min, including pressure-compensated flow control valve |
| Control | Built-in computer (with dedicated software) Profile creation / data analysis: RDT-250ECS Compatible operating systems: Windows 10 64-bit, Windows 11 64-bit, external computer required. |
| Weight | Approx. 205kg |
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