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Product Features
TAMURA (Tamura) TLF-204-MDS Solder Paste Features:
TAMURA TLF-204-MDS uses lead-free (tin/silver/copper) solder alloy;
The viscosity changes little over time during continuous printing, allowing for stable printing results;
Effectively reduces voids;
Effectively reduces solder ball formation between components;
Effectively improves preheating wetting properties;
It is a lead-free solder paste that also shows good reflow performance under high-temperature reflow profiles;
It also has good solderability on pads with 0.4mm pitch such as BGA.
Product Specifications
| Project | Features (TLF-204-MDS) | Test Method |
| Alloy Composition | Sn96.5/Ag3.0/Cu0.5 | JIS Z 3282 (1999) |
| Melting Point (℃) | 216～220℃ | Measured by DSC |
| Solder Particle Size (μm) | 25~38 μm | Measured by Laser Light Refraction Method |
| Tin Powder Shape | Spherical | JIS Z 3284 (1994) |
| Flux Content | 10.9% | JIS Z 3284 (1994) |
| Chlorine Content | 0.0% | JIS Z 3197 (1999) |
| Viscosity | 195Pa.s | JIS Z 3284 (1994) Malcom PCU Type Viscometer 25℃ |
| Aqueous Solution Resistance Test | Above 5×10⁴ Ω·cm | JIS Z 3197 (1999) |
| Insulation Resistance Test | Above 1×10⁹ Ω | JIS Z 3284 (1994) |
| Spreadability Test | Below 0.20 mm | Print solder paste on a ceramic substrate, heat at 15 ℃ 0℃ for 60 seconds, measure the spread width before and after solder heating. Measure the spread amount by the width difference. STD-092b Note |
| Solder Ball Test | Almost no solder balls occur | Print solder paste on a ceramic substrate, after melting and heating, observe with 50x microscope. STD-009e Note |
| Solder Diffusion Test | Above 76% | JIS Z 3197 (1986) |
| Copper Plate Corrosion Test | No corrosion observed | JIS Z 3197 (1986) |
| Adhesion Test of Solder Paste Residue after Reflow | Pass | JIS Z 3284 (1994) |
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