Product Video
Product Overview
Product Features
Features of TAMURA TLF-204-NH Solder Paste:
TAMURA TLF-204-NH uses lead-free (tin/silver/copper) solder alloy;
Uses halogen-free flux;
Viscosity changes little over time during continuous printing, ensuring stable printing results;
Shows good reflow performance under air reflow profile conditions;
As a lead-free solder paste, it also demonstrates good reflow performance under high-temperature reflow profiles;
It is a no-clean solder paste with good reliability.
Product Specifications
| Item | Features (TLF-204-NH) | Test Method |
| Alloy Composition | Sn96.5/Ag3.0/Cu0.5 | JIS Z 3282 (1999) |
| Melting Point (℃) | 216～220℃ | Measured by DSC |
| Solder Particle Size (μm) | 25～41 μm | Measured by Laser Diffraction Method |
| Tin Powder Shape | Spherical | JIS Z 3284 (1994) |
| Flux Content | 12% | JIS Z 3284 (1994) |
| Chlorine Content | 0.0% | JIS Z 3197 (1999) |
| Viscosity | 210Pa.s | JIS Z 3284 (1994) Malcom PCU Type Viscometer 25℃ |
| Aqueous Solution Resistance Test | Greater than 1×10⁴ Ω·cm | JIS Z 3197 (1999) |
| Insulation Resistance Test | Greater than 1×10⁹ Ω | JIS Z 3284 (1994) |
| Spread Test | Less than 0.20 mm | Print solder paste on a ceramic substrate, heat at 15℃ for 60 seconds, measure the spread width before and after solder heating. STD-092b Note STD-092b 注 |
| Solder Ball Test | Almost no solder balls occur | Print solder paste on a ceramic substrate, melt and heat, then observe with 50x microscope. STD-009e Note |
| Solder Diffusion Test | Over 70% | JIS Z 3197 (1986) |
| Copper Plate Corrosion Test | No Corrosion | JIS Z 3197 (1986) |
| Adhesion Test of Solder Paste Residue after Reflow | Pass | JIS Z 3284 (1994) |
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6, South Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
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