Semi-automatic wafer thinning and film peeling machine Wafer Detaper

SINTAIKE

STK-5120


Semi-automatic wafer thinning and film peeling machine Wafer Detaper
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  • Semi-automatic wafer thinning and film peeling machine Wafer Detaper

Product Video

Product Overview

Product Features

STK-5120 Semi-automatic Wafer Thinning Post-Peel Machine Features:

Desktop Type:

Suitable for 8"-12" wafers;

Easy to operate;

STK-5120 Semi-automatic Wafer Thinning Post-Peel Machine Performance:

Wafer Yield:

≥99.9%;

Peeling Quality:

No cracks or chips;

Hourly Capacity:

≥ 80 wafers;

MTBF:

>168 hours;

MTTR:

<1 hour;

Downtime:

<3%;

Product Changeover Time:

≤ 5 minutes.

Product Specifications

STK-5120 Semi-automatic Wafer Thinning Post-Peel Machine Features:

Desktop Type:

Suitable for 8"-12" wafers;

Easy to operate;

STK-5120 Semi-automatic Wafer Thinning Post-Peel Machine Performance:

Wafer Yield:

≥99.9%;

Peeling Quality:

No cracks or chips;

Hourly Capacity:

≥ 80 wafers;

MTBF:

>168 hours;

MTTR:

<1 hour;

Downtime:

<3%;

Product Changeover Time:

≤ 5 minutes.

Product Advantages

Application Areas

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