Semi-automatic wafer thinning and film peeling machine Wafer Detaper

SINTAIKE

STK-5020


Semi-automatic wafer thinning and film peeling machine Wafer Detaper
+
  • Semi-automatic wafer thinning and film peeling machine Wafer Detaper

Product Video

Product Overview

Product Features

STK-5020 Semi-automatic Wafer Thinning Post-Peel Machine Features:

Desktop Type:

Suitable for 4"- 8" wafers;

Easy to operate;

STK-5020 Semi-automatic Wafer Thinning Post-Peel Machine Performance:

Wafer Yield:

≥99.9%;

Peeling Quality:

No cracked pieces;

Hourly Capacity:

≥ 80 wafers;

MTBF:

>168 hours;

MTTR:

<1 hour;

Downtime:

<3%;

Product Changeover Time:

≤ 5 minutes.

Product Specifications

 

STK-5020 Semi-automatic Wafer Thinning and Film Peeling Machine Specifications:

Wafer Size:

4"- 8" wafers;

Wafer Thickness:

150 ~750 microns;

Wafer Type:

Silicon, Gallium Arsenide or other materials;

Peeling Film Type:

Peeling Tape:

Width: 38~100 mm;

Length: 100 meters;

Peeling Angle:

<45 degrees, adjustable between 5°~45°;

Wafer Chuck:

Universal (integrated) Teflon anti-static coated contact chuck;

Chuck Heating: Room temperature ~100℃;

Loading Method:

Manual placement and removal of wafers;

Anti-static Control:

Teflon anti-static coated contact chuck; static elimination ion fan;

Wafer Positioning:

Pneumatic pin positioning;

Control Unit:

PLC-based control with 7" touchscreen;

Drive Unit:

Servo motor drive;

Safety Protection:

Equipped with emergency stop button;

Power Supply Voltage:

Single-phase AC 220V, 10A;

Compressed Air:

5 kg clean dry compressed air, flow rate 100 liters/min;

Machine Enclosure:

White powder-coated metal enclosure;

Dimensions:

670 mm (W) * 1180 mm (D) * 1000 mm (H, including light);

Net Weight:

125 kg.

 

Product Advantages

Application Areas

Recommended Products

FAQ

Online Message

If you are interested in our products, please leave your email to get a free quotation, thank you!

Submit Message