Tamura Lead-Free Solder Paste
TAMURA TLF-204-171

TAMURA

TLF-204-171


Tamura Lead-Free Solder Paste<br>TAMURA TLF-204-171
Tamura Lead-Free Solder Paste<br>TAMURA TLF-204-171
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  • Tamura Lead-Free Solder Paste<br>TAMURA TLF-204-171
  • Tamura Lead-Free Solder Paste<br>TAMURA TLF-204-171

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Product Overview

Product Features

TAMURA TLF-204-171 Lead-Free Solder Paste Features:

Uses lead-free (tin/silver/copper) solder alloy;

Small viscosity change during continuous printing, stable printing quality;

Good solderability even in atmospheric conditions;

Excellent solderability when operating at high temperatures;

No-clean, with excellent reliability.

Product Specifications

Model TLF-204-171 Solder Paste Test Method
Alloy Composition Sn96.5/Ag3.0/Cu0.5 JIS Z 3282 (1999)
Melting Point 216~220 ℃ Measured by DSC
Solder Particle Size 20~36 μm Measured by Laser Light Refraction Method
Tin Powder Shape Spherical JIS Z 3284 (1994)
Flux Content 12.1% JIS Z 3284 (1994)
Halogen Content Less than 0.05% JIS Z 3197 (1986)
Viscosity 190 Pa.s JIS Z 3284 (1994)
Malcom PCU Type Viscometer 25℃

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