Tamura Lead-Free Solder Paste

TAMURA

TLF-204-111M


Tamura Lead-Free Solder Paste
Tamura Lead-Free Solder Paste
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  • Tamura Lead-Free Solder Paste
  • Tamura Lead-Free Solder Paste

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Product Overview

Product Features

TAMURA (Tamura) TLF-204-111M Solder Paste Features:

This product is made of lead-free solder alloy (tin/silver/copper);

Viscosity does not change over time during continuous printing, providing good stability;

Effectively reduces voids:

Lead-free soldering shows good heat resistance even under high-temperature reflow;

Good solderability, with sufficient wettability on gold-plated areas;

Solder balls around the chip are basically not generated;

Effectively improves the solder paste slump issue during preheating.

Product Specifications

Project TLF-204-111M Test Method
Alloy Composition Tin 96.5 / Silver 3.0 / Copper 0.5 JIS Z 3282 (1999)
Melting Point 216~220 ℃ Detected by DSC
Solder Particle Size 25~38 μm Measured by Laser Light Refraction Method
Tin Powder Shape Spherical JIS Z 3284 (1994)
Flux Content 10.9% JIS Z 3284 (1994)
Halogen Content 0.0% JIS Z 3197 (1999)
Viscosity 220 Pa.s JIS Z 3284 (1994)

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