Tamura Lead-Free Solder Paste

TAMURA

TLF-204-171A


Tamura Lead-Free Solder Paste
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  • Tamura Lead-Free Solder Paste

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Product Overview

Introduction to TAMURA TLF-204-171A Solder Paste:

The TLF-204-171A solder paste is a no-clean, lead-free solder paste made from spherical solder powder with minimal oxides and a special flux. Since the solder paste contains no lead, it greatly benefits environmental and workplace protection. In addition, this solder paste maintains excellent reliability even if its residues on the board are not removed.

Product Features

TAMURA (Tamura) TLF-204-171A Solder Paste Features:

Uses lead-free (tin/silver/copper-based) solder alloy;

Viscosity changes little during continuous printing, ensuring stable printing quality;

Exhibits good wettability on components;

Has excellent solderability even at high peak temperatures;

Maintains excellent reliability even without cleaning flux residues.

Product Specifications

Item TLF-204-171A Test Method
Alloy Composition Tin 96.5 / Silver 3.0 / Copper 0.5 JIS Z 3282 (1999)
Melting Point 216~220 ℃ Measured by DSC
Solder Particle Size 20~38 μm Measured by Laser Light Refraction Method
Tin Powder Shape Spherical JIS Z 3284 (1994)
Flux Content 12.1% JIS Z 3284 (1994)
Chlorine Content 0.0% JIS Z 3197 (1999)
Viscosity 175 Pa.s JIS Z 3284 (1994)
Malcom PCU Type Viscometer 25℃

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