Product Video
Product Overview
Introduction to TAMURA LFSOLDER TLF204-205-HF Solder Paste:
LFSOLDER TLF204-205-HF is a solder paste that contains lead-free solder powder and a special flux;
This solder paste is lead-free and halogen-free, thus making a significant contribution to protecting the global environment;
Moreover, this solder paste does not require cleaning and can achieve superior reliability;
The most notable feature of this solder paste is that after soldering and melting, it suppresses gas generation, reducing voids on various components and substrates;
For components requiring high joint reliability and heat dissipation, reducing voids helps to further ensure heat dissipation performance.
Product Features
TAMURA LFSOLDER TLF204-205-HF Solder Paste Features:
Uses lead-free (Sn/Ag/Cu) solder alloy;
This solder paste is halogen-free;
Effectively reduces voids in various components and substrates;
Minimal aging changes during continuous use, stable printability;
After reflow soldering, flux residue color is inconspicuous;
This solder paste is specially designed for N2 reflow soldering (recommended oxygen concentration ≤ 1,000 ppm);
No cleaning required, providing excellent reliability.
Product Specifications
| Project | Features (TLF-204-MDS) | Test Method |
| Alloy Composition | Sn 96.5/3.0Ag/0.5Cu | JIS Z 3282(2006) |
| Melting Point | 216～220℃ | Determined by DSC |
| Type of Tin Powder | Type4 | Laser Diffraction Method |
| Type of Flux | ROLO | IPC J-STD-004C |
| Flux Content | 11.1% | JIS Z 3197(2012) |
| Chlorine Content | 11.1% | JIS Z 3197(2012) |
| Viscosity | 190 Pa·s | JIS Z 3284-3(2014) MALCOM PCU Type Viscometer 25℃ |
Product Advantages
Application Areas
Halogen-free and lead-free 3Ag solder paste; suitable for the automotive electronics industry, used in nitrogen reflow ovens, effectively reducing void rates and meeting customers' low void rate requirements.
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Headquarter Address
6, South Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
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