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Product Features

· General products of lead-free solder;

· Can reduce bridging and crystallization;

· Can reduce the adhesion of flux residues after soldering.

 

Product Specifications

Product Name EC-19S-10 Test Method
Appearance Light Yellow Transparent Liquid Visual Inspection
Specific Gravity (20℃) 0.826 JIS Z 3197 (1999)
Viscosity (mPa·S) 4.7 JIS Z 3197 (1999)
Flash Point (℃) 11.7 JIS K 2539 (Tag Closed Cup)
Solid Content (%) 15 JIS Z 3197 (1999)
Halogen Content (%) 0.08 JIS Z 3197 (1999)
Acid Value 35 JIS Z 3197 (1999)
Copper Plate Corrosiveness Pass JIS Z 3197 (1999)
Solder Diffusion Rate* (%) 77 JIS Z 3197 (1999)

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