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Product Features

· Basically no flux residue after welding;

· Due to minimal flux residue, defects such as Check-Pin are avoided;

· Because of the good compatibility between the resin and active components in the flux, the reliability of the flux coating is high;

· Although this product has a low solid content, it basically does not cause bridging in components like QFP and small chips, and it has good wettability on pads, offering excellent operability.

Product Specifications

Product Name ULF-210R Test Method
Shape Liquid Visual Inspection
Specific Gravity (20℃) 0.802 JIS Z 3197(1986)
Solid Content (%) 5 100℃/1h
Hue Light Yellow Transparent Visual Inspection
Viscosity (mPa·S)
(30℃, Redwood Test Method)
3 JIS Z 3197(1986)
Halogen Content (%) 0 JIS Z 3197(1986)
Solder Diffusion Rate* (%) 88 JIS Z 3197(1986)
Water Resistance (Ω·cm)   
Corrosiveness of Residue Pass JIS Z 3197(1986)

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