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Product Features

· Excellent performance in improving the through-hole capability of low-Ag lead-free solder

· Uniformly improved the overall effects of cold solder joints, solder bridging, and through-hole capability

Product Specifications

Product Name CF-030AGM-3 Test Method
Appearance Light Yellow Transparent Liquid Visual Inspection
Specific Gravity (20℃) 0.822 JIS Z 3197(1999)
Viscosity (mPa·s) 4.7 JIS Z 3197(1999)
Solid Content (%) 15 JIS Z 3197(1999)
Halogen Content (%) 0.08 JIS Z 3197(1999)
Acid Value 36 JIS Z 3197(1999)
Solder Spreading Rate* (%) 77 JIS Z 3197(1999)
Copper Plate Corrosiveness Qualified JIS Z 3197(1999)

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