Product Video
Product Overview
Product Features
Measure the adhesion of solder paste;
Test items: adhesion, pressing force, sensor probe immersion depth;
Three immersion methods can be selected to simulate actual mounting conditions for testing;
By changing the set conditions, the differences in adhesion are promptly fed back to the production site;
(Set conditions: pressing force, pressing time, separation speed, immersion depth).
Product Specifications
| Model | TK-1S |
| Weight Sensor | Measurement Range: 0～400gf ±2gf Resolution: 0.25gf |
| Immersion Method | (1) Constant Pressure Immersion Method (JIS Standard) (2) Quantitative Immersion Method (3) Fixed Point Immersion Method (IPC Standard) |
| Measurement Results | (1) Adhesion Force: T gf (2) Actual Impact Force: P gf (3) Actual Immersion Depth: D μm |
| Setting Conditions | (1) Impact Force -20～-400gf (2) Impact Time 0.1～99.9s (3) Separation Speed 1.0～10.0mm/s (Constant Pressure Immersion Method / Quantitative Immersion Method) 2.0～600.0mm/min (Fixed Point Immersion Method) ※ (4) Immersion Depth 20～200μm (5) Temperature Room Temperature +10℃～250℃ |
| Weight | Approximately 10kg |
Note: When using the sensor fixed point immersion method, the immersion speed must be set between the separation speed setting value and 120mm/min to maintain the same speed as the setting value. Please note that speeds above this become 120mm/min.
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