Microporous Ceramic Vacuum Suction Cup/Carrier Plate
HAPOIN
Microporous Ceramic Vacuum Suction Cup/Carrier Plate
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Product Overview
Product Features
HAPOIN Microporous Ceramic Vacuum Chuck/Carrier Overview:
Application Scenarios:
In the semiconductor industry, during wafer thinning, shaping, slicing, grinding, cleaning, etc., the worktable is placed and fixed with a fixture [fixed jig];
A large number of interconnected or closed uniform solid or vacuum ceramic bodies are formed inside the material through high-temperature sintering to fix semiconductor wafers and other workpieces by vacuum suction;
Materials:
Worktable surface: made of alumina ceramic, with an internal hollow structure, adsorbing and fixing the adsorbed object by applying negative pressure to the porous substrate;
Base and frame: optional materials include aluminum alloy, stainless steel, ceramic, etc.;
Advantages:
1. High hardness 2. Fast heat dissipation 3. Wear resistance 4. Acid and alkali resistance, strong corrosion resistance, capable of adapting to extremely harsh environments;
Basic product parameters:
The microporous ceramic vacuum chuck has high flatness and parallelism, uniform micropore distribution, good air permeability, uniform adsorption force, and a smooth and delicate surface;
Processing objects: 2, 3, 4, 5, 6, 8, 12 inch and non-standard customized wafers, etc.;
Size range: 85mm-8800mm, micropore size: 20-60um, porosity: 30-50%;
Various non-standard chucks can be designed and customized according to customer requirements.
Product Specifications
Product Advantages
Application Areas
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