BGA Rework Station
DIC
RD-500V/RD-500SV
Product Video
Product Overview
Introduction to DIC RD-500V/RD-500SV BGA Rework Station:
Supports 0402 Rework:
Soldering of micro components is a difficult task that only specific operators can perform. Especially for 0402 (01005), which often involves substrates with high packaging density, heat impact on adjacent components can cause secondary defects. This machine changes the way hot air is conducted through the accessory top, directly contacting the component to be reworked, enabling the most effective rework of the target component without melting the solder of surrounding adjacent components.
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Product Features
Features of DIC RD-500V/RD-500SV BGA Rework Station:
High-definition tomographic camera with clear images:
Using a high-definition tomographic camera with a 120x zoom distance lens, the alignment of molds and parts or very small components can be clearly confirmed with corresponding spare parts. Precise temperature control.
By sampling data at 10 times the interval of previous models, it achieves superior reproducibility and high-precision temperature control.
Precise temperature control:
By sampling data at 10 times the interval of previous models, it achieves superior reproducibility and high-precision temperature control.
Equipped with high-power, high-response heaters:
The top and bottom heaters are equipped with 1000W power, and the area heaters are equipped with six 600W rapid-response heaters (RD-500SV has four 500W heaters). High output and fast response speed allow immediate rise to the required temperature. Since the area heaters do not require standby preheating except during reflow heating, standby power consumption is greatly reduced.
Two types of pressure sensors:
During installation and removal, although the height values vary depending on the thickness of each part, the pressure sensor of this device can automatically determine the height and save the data. Two pressure modes can be selected depending on the situation.
Non-contact cleaning:
Using a soldering iron for substrate cleaning may damage the mold; especially delicate substrates require professional cleaning operators.
Automatic Z-axis control:
To accommodate slight differences in component nozzle height and control temperature changes, an inductive sensing method is used. The nozzle height is precisely controlled in 0.1mm increments. Values are set and automatically saved in the software.
Reducing temperature differences in the machine body:
Simple operation using the same settings across multiple devices.
Product Specifications
| Maximum Substrate Size | 500×700 mm (28”×20") | 400×420 mm (16"×17") |
| Component Size Range | 01005 (0402 mm) or larger | 01005 (0402 mm) or larger |
| Zone Heater | ±0.015 mm | ±0.015 mm |
| Power Supply | AC 200-240V 5.6kW | AC 200-240V 4.0kW |
| Top Heater | 1000 W | 1000 W |
| Bottom Heater | 1000 W | 1000W |
| Area Heater | 600 W × 6 IR 3600W | 500 W × 4 IR 2000W |
| Temperature Setting Range | 0 to 650℃ | 0 to 650℃ |
| Control | Windows10 | Windows10 |
| Display | LCD Monitor | LCD Monitor |
| External Dimensions (excluding protrusions) | 700W × 755D × 758H mm (27.55”W × 29.72"D × 29.84"H) | 620W × 620D × 758H mm (24.40"W × 24.40"D × 29.84"H) |
| Weight | 100 kg (220.46 lbs) | 70 kg (154.32 lbs) |
| Supply Air | 0.5 MPa 110 L/min (90 PSIG) | 0.5 MPa 110 L/min (90 PSIG) |
Product Advantages
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