High-Temperature Warpage Testing Device
MALCOM SRS-360Q/SRS-600Q
MALCOM
SRS-360Q/SRS-600Q
Product Video
Product Overview
Summary:
In recent years, as AI-related semiconductor packaging and printed circuit boards (PCBs) have evolved toward higher density and larger sizes, serious reliability issues have emerged during the bonding process with components such as ball grid array (BGA) devices. This issue stems from "warpage"—the deformation of substrates and packaged components caused by heating and cooling during bonding.
This device uses a high-resolution laser sensor with a resolution of up to 1000 dpi (dots per inch) to perform three-dimensional displacement measurements, enabling it to detect overall "warpage" and deformation—from BGA components down to large-sized substrates.
The measurement method of this device is as follows: Throughout the entire process—from heating to cooling—surface temperatures at all locations on the encapsulated components and substrate surfaces are repeatedly measured, calculated, and provided to the user, along with their relationship to "warpage."
Product Features
MALCOM high-temperature warpage equipment features a user-friendly operating interface. First, the test can be completed in just 3 steps: ① set the reflow soldering temperature curve parameters; ② place the bag-packaged substrate sample inside; and ③ start the equipment and wait for the detection results. The entire process requires no specialized technical personnel—ordinary operators can easily get started after a brief training session.
Secondly, in terms of operational convenience, there’s no need for steps like spraying white paint, pre-baking, or removing balls before detection—saving not only workspace but also significantly reducing labor and time. Finally, in terms of appearance design, a transparent window has been incorporated, enabling visual observation and allowing real-time monitoring of material deformation inside the furnace at various temperatures.
Product Specifications
Product | MALCOM High-Temperature Warpage Testing System | |
Model | SRS-360Q | SRS-600Q |
Principle of measurement | Laser Scanning Method | |
Light source | Blue Semiconductor Laser, 405nm, Class 2M | |
Measuring light amplitude | X-axis: 144mm | |
Determining Reproducibility (Repeatability accuracy) | Z-axis: 2 µm | |
Determine the temperature range | Room temperature to 300°C | |
Heating rate | Maximum rate: 3°C/sec ※Depends on sample shape | |
Sample Size | 360mm × 360mm | 600mm × 600mm |
Visual field testing | 345mm × 345mm | 576mm × 576mm |
Resolution (dots per inch) | Wide-angle mode: Below 100 dpi Pancake mode: 1000 dpi | |
Measure spacing (pixels) | Wide-angle mode: 250 µm and above Narrow-angle mode: 25 µm | |
Time · Scan Count | Wide-angle mode: 6 seconds / 3 or more times | Wide-angle mode: 12 seconds / 4 or more shots |
Number of data points | Up to 360 billion points | |
Measurement Area | Automatic Tracking | |
Elements | Wide-angle mode | Narrow-angle mode |
Time measurement | 〇Short | X-Length |
Data Resolution | × Low (Rough) | 〇 High (Clear) |
Data Volume | 〇Small | X University |
Wide-angle mode is suitable for samples that don’t require high resolution and are relatively large in size.
Narrow-angle mode is suitable for samples that require high resolution.
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