MEISHO MS8800 BGA Soldering Station

MEISHO


MEISHO MS8800 Hot Air BGA Rework Station
MEISHO MS8800 BGA Soldering Station
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  • MEISHO MS8800 BGA Soldering Station

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Product Overview

The MS8800 hot-air BGA rework station is an advanced solution for electronic repair, enabling fast and precise BGA chip removal and installation. Featuring a modern design, high automation capabilities, and an intelligent temperature-control system, the machine ensures stable performance and safe operation. The MS8800 is ideal for electronics component manufacturing and repair businesses, helping to enhance quality and streamline workflow processes.

Product Features

  • Highly automated, it can complete desoldering, suction, and chip placement with just one button press.
  • High-power brushless fan, requiring no external compressed air connection, utilizes a closed-loop sensor system to deliver a stable, high-volume flow of hot air.
  • Large-capacity heating design featuring two top-mounted burners, with 8-zone temperature control and integrated 3-zone spatial heating across the entire machine—enabling effortless handling of reflective BGAs, multilayer BGAs, shielded metal-cased components, and POPs, while ensuring a high success rate for reballing operations.
  • The HD optical alignment system features color-distinguishing prisms, delivering high precision and crystal-clear images.
  • High-powered horizontal fan, automatically adjusts for efficient cooling.
  • The SOFT touch interface not only manages access permissions but also integrates a Profile Analysis function, enabling the evaluation of parameters such as heating rate, peak temperature, holding time, cooling rate, and more.
  • Hot-air nozzle with a magnetic mechanism, accompanied by various alloy vent caps for quick and convenient adjustments.

Product Specifications

Model MS8800
Power source AC 220V 50Hz
Capacity 4800W
Hot air rising from above 1200W / 100–400℃
Hot air rising from below 1200W / 100–400℃
Infrared heating from below Infrared on Friday * 6 × 400W = 2400W
PCB size 400 x 400 mm (Maximum)
Alignment method Optical prism, accuracy ±0.02mm
Camera alignment Dedicated 2.13-megapixel camera
Source of gas Integrated air fan, no compressed air required
How to move the heating table Adjusting micro-level precision with a micrometer ruler
Screen alignment 10-inch HD display
Software interface 10-inch touchscreen
Overall dimensions 665 × 600 × 900 (mm)
Weight About 60 kg

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