Product Video
Product Overview
Introduction: A single-component, modified epoxy resin adhesive used for BGA 、 CSP , consumer electronics products, and automotive electronics bottom filling processes. It can form a consistent and defect-free bottom filling layer, filling large bottom gaps to achieve reinforcement, BGA enhancing BGA packaged chips and PCBA drop resistance between them.
Product Features
Features: Bottom underfill is a low-viscosity, low-temperature curing capillary flow underfill material. (Underfill), Good process operability, easy maintenance, impact and drop resistance, good vibration resistance, fast flow speed, long service life, excellent reworkability, greatly improving the reliability of electronic products.
Advantages:
1 High reliability (anti-detachment, impact resistance, high temperature and high humidity resistance);
2、 Good flowability ；
3 Balanced reliability and reworkability;
4 Helps transfer heat, acting as a heat sink;
5 Prevents moisture penetration.
Application fields:
- 1、 Consumer electronics ：
BGA chip packaging in mobile phones, tablets, speakers, and cameras, BGA chip packaging, used to improve drop resistance.
- 2、 Automotive electronics ：
Protects solder joints of in-vehicle control modules under high temperature and high vibration environments to ensure reliability.
- 3、 Industrial and aerospace fields ：
Provides packaging protection for sensors, communication devices, etc., requiring high reliability to adapt to harsh working environments.
- 4、 Advanced packaging field ：
In chip-scale packaging ( CSP ) and ball grid array ( BGA ) applications, fills the gap under components by capillary action to disperse thermal and mechanical stress, enhancing connection strength and stability.
Product Specifications
Attribute | Value | Test Condition |
Product | Underfill Base Material Filling Adhesive |
|
Chemical Properties | Epoxy Resin |
|
Viscosity Pa·s | 29,500 mPa·s | @25°C B Viscometer |
Filler Size | 10 μm | Maximum Size |
Flowability | 10mm | GAP 50 μm Glass/Glass 100x60sec |
Product Advantages
Application Areas
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FAQ
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OUTLETS
Service Outlets
Shanghai-Head Office
Shanghai Hapoin Enterprise Development Co., Ltd.
Address: Building 6, Southern Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
Telephone:+86 150 2686 5822
Email:info@hapoin.com
Shenzhen Branch
Shenzhen Hapoin Ruihe Technology Development Co., Ltd.
Address: Room 302, 3rd Floor, Building B, Kaicheng High-tech Park, Dalang Street, Longhua District, Shenzhen
Telephone:+86 0755 2223 2285
Email:sales@hapoin.com
Hong Kong Branch
HAPOIN ENTERPISE LIMITED
Address: Unit 917A, 9/F., Tower A, New Mandarin Plaza, No. 14 Science Museum Road
Telephone:+00852 61187991
Email:sales@hapoin.com
Vietnam Branch
HAPOIN VIETNAM
Address: 6th Floor, CTM Office Building, No. 139, Zhipiao Road, Zhipiao District, Hanoi, Vietnam
Telephone:+84 398 848 969
Email:sales@hapoin.com
Japan Branch
HAPOIN CO., LTD.
Address: 6th Floor, 2-3-8 Iwamotocho, Chiyoda-ku, Tokyo
Telephone:+81 070 9356 1267
Email:sales@hapoin.com
Kunshan Office
Kunshan Office
Address: 10th Floor, Building B, Modern Plaza, No. 8, Weiye Road, Yushan Town, Kunshan City
Telephone:+86 150 2686 5822
Email:sales@hapoin.com
Taipei Branch
Uniwin Chemical Co.,LTD.
Address: No. 14, Alley 3, Lane 250, Section 2, Huanhe South Road, Taipei 10853
Telephone:+886 02 2336 2202
Email:sales@hapoin.com
Beijing Office
Beijing Office
Address: Room 306, Building 4, Zhongtou Oriental, West Zhihe North, Chaoyang District, Beijing
Telephone:+86 150 2686 5822
Email:sales@hapoin.com
Contact Number
Headquarter Address
6, South Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
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