Aluminum Nitride Ceramic Substrate
HAPOIN
Aluminum Nitride Ceramic Substrate
Product Video
Product Overview
Product Features
Overview of HAPOIN Aluminum Nitride Ceramic Substrate:
Product Advantages:
1. Thermal conductivity >170W/m.k; approximately 7 times higher thermal conductivity compared to alumina; better mechanical strength than alumina;
2. High electrical insulation, low dielectric constant, and low dielectric loss;
3. Thermal expansion coefficient close to silicon, achieving high reliability for mounting large silicon chips and thermal cycling;
4. Good corrosion resistance to molten metals;
5. Extremely low impurity content, non-toxic, high purity;
Product Applications:
Heat dissipation substrates, LED packaging substrates, semiconductor substrates, thin film circuit substrates, power resistor substrates.
Product Specifications
Product Advantages
Application Areas
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Shanghai Headquarters
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Address: Building 6, Southern Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
Inquiry Hotline:+86 150 2686 5822
Email:info@hapoin.com
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Address: Room 302, 3rd Floor, Building B, Kaicheng High-tech Park, Dalang Street, Longhua District, Shenzhen
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Address: 6th Floor, CTM Office Building, No. 139, Zhipiao Road, Zhipiao District, Hanoi, Vietnam
Telephone:+84 243 796 0048
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Address: 10th Floor, Building B, Modern Plaza, No. 8, Weiye Road, Yushan Town, Kunshan City
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Address: No. 14, Alley 3, Lane 250, Section 2, Huanhe South Road, Taipei 10853
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Shanghai Hengpeng Enterprise - Beijing Office
Address: Room 306, Building 4, Zhongtou Oriental, West Zhihe North, Chaoyang District, Beijing
Telephone:+86 150 2686 5822
Email:sales@hapoin.com
Contact Number
Headquarter Address
6, South Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
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