Alumina ceramic substrate

HAPOIN

Alumina ceramic substrate


Alumina ceramic substrate
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  • Alumina ceramic substrate

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Product Overview

Product Features

Overview of HAPOIN Alumina Ceramic Substrates:

Applications:

Widely used in electronic component heat dissipation substrates, high-power circuit substrates for automotive and other industries, copper-clad laminates, printers, LED lighting, and communication fields;

Product Advantages:

Good thermal conductivity and thermal shock resistance, excellent surface characteristics and flatness, high dimensional accuracy, corrosion resistance, stable physical and chemical properties, high insulation performance, low dielectric constant and dielectric loss, excellent mechanical strength;

Material Grades:

92%, 96%, 98%, 99%, 99.5% alumina;

Process Types:

Laser scribing, mold stamping;

Thickness Range:

Minimum thickness 0.2mm, maximum thickness 3.0mm;

Length Range:

Maximum length 420mm, maximum width 240mm;

Aperture Range:

Minimum aperture φ0.07mm.

 

Product Specifications

Product Advantages

Application Areas

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