Advanced Semi-Automatic Wafer Detaper

SINTAIKE

STK-5150


Advanced Semi-Automatic Wafer Detaper
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  • Advanced Semi-Automatic Wafer Detaper

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Product Overview

Product Features

Features of STK-5150 Advanced Semi-Automatic Wafer Film Peeling Machine:

Suitable for 8" & 12" wafers;

Easy to operate;

Performance of STK-5150 Advanced Semi-Automatic Wafer Film Peeling Machine:

Wafer yield;

≥99.9%;

Film peeling quality;

No cracked pieces;

Hourly capacity;

≥ 80 wafers;

Product changeover time;

≤ 5 minutes.

Product Specifications

     

STK-5150 Advanced Semi-Automatic Wafer Film Peeling Machine Specifications:

Wafer Size:

8" & 12" wafers;

Thickness:

150 ~ 750 micrometers

Wafer Types:

Silicon, Gallium Arsenide; flat edge or V-notch wafers;

Peeling Film Types:

Peeling tape;

Width: 100~150 mm;

Length: 100 meters;

Peeling Angle:

Less than 45 degrees, adjustable between 5°~45°;

Peeling Temperature:

Adjustable from room temperature to 100°C, temperature control accuracy +/-3°C;

Wafer Chuck:

Universal anti-static Teflon-coated contact metal chuck;

With controllable heating function, maximum temperature up to 100°C;

Chuck Vacuum Suction Function:

Loading and unloading method;

Manual wafer placement and removal:

Anti-static control;

Ion fan;

Wafer positioning;

Spring pin positioning;

Control Unit;

PLC-based control with 5.7" touchscreen;

Drive Unit;

Servo motor drive;

Safety Protection;

Equipped with emergency stop button;

Power Supply Voltage;

Single-phase AC 220V, 10A;

Compressed Air;

5 kg clean dry compressed air, flow rate 80 liters per minute;

Machine Enclosure;

White spray-painted metal enclosure;

Machine Indicators:

Three-color tower light indicating machine working status;

Dimensions:

950 mm (W) x 1500 mm (D) x 1800 mm (H, including tower light);

Net Weight;

300 kg.

 

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