Floor-standing advanced automatic wafer thinning and coating machine Wafer Taper

SINTAIKE

STK-6050


Floor-standing advanced automatic wafer thinning and coating machine Wafer Taper
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  • Floor-standing advanced automatic wafer thinning and coating machine Wafer Taper

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Product Overview

Product Features

Floor-standing Wafer Laminating Machine STK-6050 Advanced Semi-automatic Wafer Thinning Laminating Machine Features:

Patented design flexible roller laminating, automatic film pulling, automatic laminating;

Spring blade automatic cutting system, automatic film cutting, waste film collection;

Suitable for 4" - 8" wafers, silicon, silicon carbide, gallium arsenide, sapphire, glass, etc.

Floor-standing Wafer Laminating Machine STK-6050 Advanced Semi-automatic Wafer Thinning Laminating Machine Performance:

Wafer yield:

≥99.9%;

Laminating quality:

No bubbles (excluding dust particle bubbles);

Hourly capacity:

≥ 75 wafers;

MTBF:

>168 hours;

MTTR:

<1 hour;

Downtime:

<3%;

Product changeover time:

≤ 10 minutes.

Product Specifications

STK-6050 Floor-standing Advanced Automatic Wafer Thinning and Film Lamination Machine Parameters:

Wafer Diameter:

4” - 8” wafers;

Wafer Thickness:

300~750 micrometers;

Wafer Types:

Silicon, Gallium Arsenide or other materials;

Film Types:

Blue film or UV film (adhesion ≤8N/20mm);

Width: 120~240 mm;

Length: 100 meters;

Thickness: 0.05~0.2 mm;

Lamination Principle:

Anti-static roller lamination, adjustable roller pressure;

Wafer Chuck:

Universal (integrated) Teflon anti-static coated contact chuck;

Chuck heating: room temperature to 100℃;

Manual Chuck Lift:

Loading and unloading method;

Manual wafer placement and removal;

Anti-static Control:

Anti-static Teflon coated wafer chuck / anti-static lamination roller / static elimination ion fan;

Cutting System:

Automatic cutting blade, 8” without cutting V notch function, cutting blade heating: room temperature to 120℃;

Cutting Blade Life Management:

Waste film handling;

Automatic collection;

Lamination Accuracy:

X-Y: ±0.5mm; θ: ±0.5°;

Wafer Positioning:

Pneumatic pin positioning;

Control Unit:

PLC-based control, 10.1” touchscreen;

Safety Protection:

Equipped with safety light curtain and emergency stop switch;

Power Supply Voltage:

Single-phase AC 220V, 16A;

Compressed Air:

Compressed air: 5 kg clean dry compressed air, flow rate 100 liters/min;

Dimensions:

850 mm (W) * 1450 mm (D) * 1700 mm (height excluding light);

Net Weight:

450 kg.

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