Floor-standing advanced semi-automatic wafer cutting and mounting machine Wafer Mounter

SINTAIKE

STK-7150


Floor-standing advanced semi-automatic wafer cutting and mounting machine Wafer Mounter
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  • Floor-standing advanced semi-automatic wafer cutting and mounting machine Wafer Mounter

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Product Features

Wafer Laminating Machine STK-7150  Floor-standing Advanced Semi-automatic Cutting and Laminating Machine Features:

Floor-standing, suitable for 8-12 inch silicon wafers, silicon carbide, gallium arsenide, sapphire, glass and other materials;

Automatic cutting blade, automatic film cutting, automatic waste film collection;

Automatic film pulling, automatic laminating, capable of laminating empty rings/frames;

Wafer Laminating Machine STK-7150  Floor-standing Advanced Semi-automatic Cutting and Laminating Machine Performance:

Wafer Yield:

≥99.9%;

Film Peeling Quality:

No bubbles (excluding dust particle bubbles);

Hourly Capacity:

≥ 70 wafers;

MTBF:

>168 hours;

MTTR:

<1 hour;

Downtime:

<3%;

Product Changeover Time:

≤ 10 minutes.

Product Specifications

Wafer Laminating Machine STK-7150  Floor-standing Advanced Semi-automatic Cutting and Laminating Machine Specifications:  

Wafer Diameter:

8", 12" wafers;

Wafer Thickness:

100 ~ 750 micrometers;

Wafer Types:

Silicon, Gallium Arsenide, or other materials;

Film Types:

Blue film or UV film (adhesion ≤ 8N/20mm);

Width: 300–400 millimeters;

Length: 100 meters;

Thickness: 0.05~0.2 millimeters;

Wafer Carrier Ring:

8", 12" DISCO standard;

Laminating Principle:

Anti-static roller laminating, adjustable roller pressure;

Wafer Chuck:

Universal (integrated) Teflon anti-static coated contact chuck;

Chuck heating: room temperature ~ 100℃;

Manual chuck lifting;

Loading and Unloading Method:

Manual placement and removal of wafers/carrier rings;

Anti-static Control:

Anti-static Teflon coated wafer chuck / anti-static laminating roller / static elimination ion fan;

Cutting System:

Ring cutter for 8", 12" DISCO carrier rings;

Waste Film Handling:

Automatic collection;

Laminating Accuracy:

X-Y: ±0.5mm; θ: ±0.5°;

Positioning Method:

Wafer pneumatic pin positioning / carrier ring spring pin positioning;

Control Unit:

PLC-based control with 10.1" touchscreen;

Safety Protection:

Equipped with light curtain protection and emergency stop button;

Power Supply Voltage:

Single-phase AC 220V, 16A;

Compressed Air:

5 kg clean dry compressed air, flow rate 100 liters/min;

Machine Enclosure:

White spray-painted metal enclosure;

Dimensions:

850 mm (W) * 1450 mm (D) * 1700 mm (height excluding light);

Net Weight:

485 kilograms.

 

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