Semi-automatic Wafer Cutting and Mounting Machine Wafer Mounter

SINTAIKE

STK-7020


Semi-automatic Wafer Cutting and Mounting Machine Wafer Mounter
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  • Semi-automatic Wafer Cutting and Mounting Machine Wafer Mounter

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Product Overview

Product Features

Semi-automatic Wafer Film Laminator STK-7020 Features of Precise Wafer Dicing Film Lamination:

Desktop semi-automatic type, automatic film pulling, automatic film lamination;

Suitable for 4"-8" wafers (silicon, silicon carbide, gallium arsenide, gallium nitride, sapphire, glass, and other materials) for applying blue film and UV film;

Easy operation, high UPH (units per hour);

Performance of Semi-automatic Wafer Film Laminator STK-7020 for Precise Wafer Dicing Film Lamination;

Wafer yield:

≥99.9%;

Film lamination quality:

No bubbles (excluding dust particle bubbles);

Hourly capacity:

≥ 80 wafers;

MTBF (Mean Time Between Failures):

>168 hours;

MTTR (Mean Time To Repair):

<1 hour;

Downtime:

<3%;

Product changeover time:

≤ 5 minutes.

 

Product Specifications

STK-7020 Semi-Automatic Wafer Cutting and Film Lamination Machine Specifications:

Wafer Size:

4"- 8" wafers;

Wafer Thickness:

100 ~750 micrometers;

Wafer Types:

Silicon, Gallium Arsenide, or other materials;

Film Types:

Blue film or UV film (adhesion ≤8N/20mm);

Width: 210~300 millimeters;

Length: 100 meters;

Thickness: 0.05~0.2 millimeters;

Wafer Carrier Ring:

6", 8" DISCO standard;

Lamination Principle:

Anti-static roller lamination, adjustable roller pressure;

Lamination Operation:

Automatic film pulling and lamination;

Wafer Stage:

Universal (integrated) Teflon anti-static coated contact stage;

Stage heating: room temperature to 100℃;

Manual stage lifting;

Loading and Unloading Method:

Manual placement and removal of wafers/carrier rings;

Anti-static Control:

Anti-static Teflon coated wafer stage / anti-static lamination roller / static elimination ion fan;

Cutting System:

Manual circular cutter and straight cutter;

Positioning Method:

Pneumatic pin positioning for wafers / spring pin positioning for carrier rings;

Control Unit:

PLC-based control with 7" touch screen;

Safety Protection:

Equipped with emergency stop button;

Power Supply Voltage:

Single-phase AC 220V, 10A;

Compressed Air:

5 kg clean dry compressed air, flow rate 100 liters/min;

Machine Enclosure:

White spray-painted metal enclosure;

Dimensions:

670 mm (W) * 1180 mm (D) * 1000 mm (H, including light);

Net Weight:

140 kilograms.

 

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