Fully Automatic Wafer Dicing and Film Mounting Machine (Roller) Wafer Mounter

SINTAIKE

STK-7200R


Fully Automatic Wafer Dicing and Film Mounting Machine (Roller) Wafer Mounter
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  • Fully Automatic Wafer Dicing and Film Mounting Machine (Roller) Wafer Mounter

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Product Overview

Product Features

STK-7200R_SINTAIKE Fully Automatic Wafer Cutting and Film Laminating Machine (Roller) Features:

Fully automatic wafer/frame loading and unloading:

Japanese imported wafer handling robotic arm, wafer alignment system;

Fully automatic wafer film laminating:

Standard ESD Teflon electroplated contact wafer chuck;

Supports DBG process: peel BG film after laminating;

Laminating action: automatic film pulling and laminating;

Wafer stage: universal (integrated) Teflon anti-static coated contact stage; or silicone stage, or ceramic stage;

For detailed parameters, please feel free to contact us.

Product Specifications

STK-7200R Fully Automatic Wafer Roller Mounter Specifications:

Wafer Size:

Diameter: 6", 8.

Wafer Thickness:

150 ~ 725 µm.

Wafer material:

Si, SiC.

Wafer Type:

Single Flat, Double Flat or V-Notch.

Tape Type:

Blue Tape or UV Tape.

Width: 230, 300 mm; Length: 100 m; Thickness: 0.05 ~ 0.2 mm.

Frame Type:

6" DISCO or K&S, 8" DISCO or K&S; or Customer Specified.

Mounting Theory.

Roller Mounting.

Wafer Place Accuracy.

X-Y: +/- 0.1 mm; Θ: +/- 0.1°.

Input & Output:

Dual Input Wafer Cassette / Single Output Frame Cassette.

ESD Control:

ESD Roller / ESD Wafer Chuck / ESD Ion Blower.

Wafer Transfer:

Horizontal Multi-Axis Robot with Vacuum or Bernoulli End-effector.

Wafer Position & Warpage Intelligent Mapping in Cassette.

Wafer Alignment:

Fiber Sensor for Wafer Alignment.

Control Unit:

Standard Industrial PC with 17" Touch Panel LCD / Windows O/S.

Power Supplier:

Single Phase AC 220 V, 25A.

Air Supplier:

5.0 Kgf/cm² CDA, 150 L/min.

Machine Construction:

Made of Full Aluminium Profile.

Dimensions:

1750 mm (W) × 1350 mm (D) × 1800 mm (H).

Net Weight:

870 Kg.

 

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