Fully Automatic Wafer Dicing and Film Mounting Machine (Vacuum) Wafer Mounter

SINTAIKE

STK-7200V


Fully Automatic Wafer Dicing and Film Mounting Machine (Vacuum) Wafer Mounter
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  • Fully Automatic Wafer Dicing and Film Mounting Machine (Vacuum) Wafer Mounter

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Product Overview

Product Features

Fully Automatic Wafer Film Cutting Machine (Vacuum) STK-7200V Features:

Special vacuum mounting technology without rollers (roller mounting optional);

Equipped with imported multi-axis wafer handling robotic arm;

Capable of applying film on thinner wafers for film cutting;

Intelligent feedback on wafer position and warpage;

17-inch touchscreen LCD industrial computer control;

Film application operation: fully automatic film pulling and application, waste film collection;

For detailed specifications, please feel free to contact us.

Product Specifications


STK-7200V Fully Automatic Wafer Vacuum Mounter Specifications:

Wafer Size:

Diameter: 4", 5", 6" & 8".

Wafer Thickness:

80 ~ 750 um.

Wafer material:

Si, SiC.

Wafer Type:

Single Flat, Double Flat or V-Notch.

Tape Type:

Blue Tape or UV Tape.

Width: 230, 300 mm; Length: 100 m; Thickness: 0.05 ~ 0.2 mm.

Frame Type:

6" DISCO or K&S, 8" DISCO or K&S; or Customer Specified.

Mounting Theory.

Vacuum Mounting.

Wafer Place Accuracy:

X-Y: +/- 0.1 mm    Θ: +/- 0.1°.

Input & Output:

Dual Input Wafer Cassette / Single Output Frame Cassette.

ESD Control:

ESD Roller / ESD Wafer Chuck / ESD Ion Blower.

Wafer Transfer:

Horizontal Multi Axis Robot with Vacuum or Bernoulli Endeffector.

Wafer Position & Warpage Intelligent Mapping in Cassette.

Wafer Alignment:

Fiber Sensor for Wafer Alignment.

Control Unit:

Standard Industrial PC with 17” Touch Panel LCD / Windows O/S.

Power Supplier:

Single Phase AC 220 V, 25A.

Air Supplier:

5.0 Kgf/cm² CDA, 150 L/min.

Machine Construction:

Made of Full Aluminium Profile.

Dimensions:

1750 mm (W) × 1350 mm (D) × 1800 mm (H).

Net Weight:

870 Kg.

 

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