Semi-automatic wafer temporary bonding machine

SINTAIKE

STK-8050


Semi-automatic wafer temporary bonding machine
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  • Semi-automatic wafer temporary bonding machine

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Product Overview

Product Features

Compatible wafer diameters: 4", 6", 8" / 8", 12";

Loading and unloading method: manual placement and removal of wafers;

Bonding method: vacuum bonding;

Chuck: one chuck corresponds to one size of wafer;

Control unit: PLC-based control with a 7-inch touch screen.

Product Specifications

Product Advantages

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