Wave Soldering Oven Front Inspection Equipment

MITO DENKO

MID-D100 2D AOI


Wave Soldering Oven Front Inspection Equipment
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  • Wave Soldering Oven Front Inspection Equipment

Product Video

Product Overview

Product Features

Advanced models and intelligent algorithms;

Completely independent intellectual property rights;

Simple structure, easy for quick installation;

Floor-mounted installation, no need to modify the production line;

Online non-intrusive detection, quickly providing results as PCBA passes through;

High-precision motion system to ensure stop-and-go accuracy at high speeds.

Product Specifications

Device Type Floor-standing
Detection Method Convolutional Neural Networks, advanced deep learning models, computer vision, graphic image processing
Program Development 2-10 minutes for new models
Program Debugging Time Within 10 minutes
Minimum Measurable Component Length*Width ≥ 5.0mm*5.0mm
Detection Speed 5S/FOV
Minimum Measurable PCB Size Length*Width > 50mm*50mm
Maximum Measurable PCB Size Width ≤ 400mm, length unlimited; optional width 750mm, length unlimited
Camera Resolution 20MP full color or 12MP full color, selectable based on application environment
Pixel Size 2.4μm (20MP full color), 3.45μm (12MP full color)
Installation Method Floor-standing embedded production line installation, no need to modify the assembly line. Fast and convenient.
Device Accuracy 20MP: typical object distance is 300mm, accuracy is 66μm

Product Advantages

Application Areas

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