Flatness/Levelness/Evenness/Warpage Tester

TDM

LARGE SCALE


Flatness/Levelness/Evenness/Warpage Tester
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  • Flatness/Levelness/Evenness/Warpage Tester

Product Video

Product Overview

TDM–LS (LARGE SCALE) Flatness/Planarity/Evenness/Warpage Tester/Warpage Analysis:

The TDM–LS (LARGE SCALE) is a versatile instrument for a wide range of applications in process development, failure analysis, reliability, and quality control. To provide a comprehensive product solution for the demand for warpage measurements, the TDM Large Scale complements the TDM Compact. The first generation of TDM was designed for surface analysis of relatively small areas (up to 150x150 mm), while the TDM Large Scale offers surface inspection of areas up to 400x400 mm. This enables thermo-mechanical analysis of boards, wafers, and other large objects.

ABSOLUTE 3D CARTOGRAPHY

TDM is a patented tool for warpage analysis under a temperature profile. It uses fringe projection technology (also called projection moiré) for non-contact, full-field acquisition of 3D topographies with a resolution as low as 1.5 µm. TDM-Compact acquires a full, absolute 3D cartography of devices with dimensions up to 600 mm x 430 mm. Its powerful heating and cooling capabilities allow virtually any temperature profile on the sample under test. The integrated software provides tools for representing results as 3D plots, vector diagrams, isometric views, and 2D profiles following user-defined profile lines (e.g., diagonal plots).

LARGE SAMPLE SIZE CAPABILITY:

Component qualification for reflow profile compatibility.

Component curing process optimization.

Component and PCB characterization following JEITA-ED-7306, IPC-9641, JEDEC 22B112A, and IPC/JEDEC J-STD-020D standards.

Fast aging test profiles, ON/OFF cycles, etc.

LARGE SCALE ADVANTAGES:

Independently controlled top and bottom heater banks for superior temperature uniformity.

Fast heating and cooling ramp.

Ultra-high resolution camera for fine feature analysis (e.g., measurement of solder balls/bumps, leads, pins, etc.) and more accurate warpage measurements.

Sample drawer for easy sample loading.

Product Features

Product Specifications

Imaging : Direct sample illumination, non-contact measurement
Capabilities : Topography analysis: z(x,y) function of the temperature
Maximum samples size : 600 mm x 430 mm
Oven size : 400 mmx 400 mm
Field of view (x,y) : Adjustable Zoom from 30 x 30 to 400 x 400 mm
Depth of view (z) : Up to 25 mm
CCD camera resolution : 5 megapixel
Accuracy : +/-1 micron or 2% of measured value, whichever is greater
(x,y) resolution : 15 μm to 200 μm depending on the FOV
Temperature range : Room temperature to 300° C continuous
Heating method : IR lamps - top and bottom
Heating rate : Up to +2.5° C/s (sample dependent)
Cooling method : Internal ventilation
Cooling rate : Up to -2° C/s above 120° C
Footprint : 200 cm x 150 cm x 250 cm
Weight approx : 500 kg
Utilities : Electricity: Electricity: 380 VAC, 50 Hz, 3 phases, Fumes extraction 2000m3/h.

Product Advantages

Application Areas

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