Inverted Chip Dedicated Solder Paste

TAMURA

SAM30-401E-15


Inverted Chip Dedicated Solder Paste
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  • Inverted Chip Dedicated Solder Paste

Product Video

Product Overview

Introduction to TAMURA SAM30-401E-15 Solder Paste:

It is a material used for anisotropic conductive connections and is a type of anisotropic conductive adhesive. Since it is used for soldering, it is emphasized as an anisotropic conductive adhesive.

Product Features

Product Specifications

Project SAM30-401E-15
Appearance Gray
Application Method Spraying
Connection Method Soldering Joint
Resin Epoxy Resin
Environmental Compliance Halogen-Free
Lead-Free
Particle Size 5-20μm
Pre-curing Time 10 seconds
Pre-curing Temperature 130℃
Bonding Time 15 seconds
Bonding Temperature 180℃
Bonding Pressure 3MPa
Compatible Connection Density ≥0.2mmP (L/S=100μm/100μm)
Storage Time < -10℃ 6 months
Activation Period 30℃ 24h
Insulation Resistance ≥1.0E+8Ω
Peel Strength (90° Peel) Initial: 0.72N/mm
TCT 1000 cycles: 0.75N/mm
THT 1000h: 0.73N/mm
TCT (-40℃⇔125℃) Conductive Resistance: 1000 cycles O.K.
THT (85℃ 85%RH) Insulation Resistance: 1000h O.K.

Product Advantages

Application Areas

Based on the thermocompression of anisotropic conductive adhesive, high-precision multi-circuit one-time connections become possible. It is a technology that serves as an alternative to connectors and soldering.

 

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