High Reliability Lead-Free Solder Paste

TAMURA

TLF-286-GTS-VR5


High Reliability Lead-Free Solder Paste
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  • High Reliability Lead-Free Solder Paste

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Product Overview

Product Features

TAMURA (Tamura) TLF-286-GTS-VR5 Solder Paste Features:

Exhibits excellent heat resistance even under high-temperature reflow, high reliability, high trustworthiness solder paste, excellent effect in preventing component breakage, and maintains soldering quality under thermal shock cycling.

Pb-free (Sn/Ag/Cu/Bi/Sb system) solder alloy is used.

Excellent insulation characteristics can be obtained under conditions of high temperature and high humidity.

Crack-resistant flux residues. Suitable for N2 reflow.

Product Specifications

Project TLF-286-GTS-VR5 Test Method
Alloy Composition Sn / Ag3.0 / Cu0.7 / Bi3.2 / Sb3.0 JIS Z 3910(2017)
Melting Point 209~224℃ JIS Z 3198-1(2014)
Solder Particle Size 20~38μm Using Laser Light Refraction Method
Tin Powder Shape Spherical JIS Z 3284-2(2014)
Flux Content 11.5% JIS Z 3197(2012)
Halogen Content 0% JIS Z 3197(2012)
Viscosity 210Pa.s JIS Z 3284-3(2014)
Malcom PCU Type Viscometer 25℃

Product Advantages

Application Areas

Automotive electronics, as well as industries with high reliability requirements, need products that can withstand thermal shock.

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