Tamura Lead-Free Solder Paste

TAMURA

TLF-204-49


Tamura Lead-Free Solder Paste
Tamura Lead-Free Solder Paste
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  • Tamura Lead-Free Solder Paste
  • Tamura Lead-Free Solder Paste

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Product Overview

Product Features

TAMURA (Tamura) TLF-204-49 Solder Paste Features:

This product is made of lead-free solder alloy (tin/silver/copper);

Solder balls around the chip are basically not produced;

Viscosity does not change over time during continuous printing, showing good stability;

Exhibits good soldering performance even on fine-pitch components;

Good soldering performance, demonstrating excellent wettability for various different components;

Lead-free soldering, showing good solderability even under high-temperature reflow conditions.

Product Specifications

Project TLF-204-49 Test Method
Alloy Composition Sn96.5/Ag3.0/Cu0.5 JIS Z 3282 (1999)
Melting Point 216~220 ℃ Detected by DSC
Solder Particle Size 25~38 μm Measured by Laser Light Refraction Method
Flux Content 11.7% JIS Z 3284 (1994)
Halogen Content Less than 0.05% JIS Z 3197 (1999)
Viscosity 210 Pa.s JIS Z 3284 (1994)

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