Low void/low bubble solder paste

TAMURA

TLF-204-GT01


Low void/low bubble solder paste
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  • Low void/low bubble solder paste

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Product Overview

Product Features

TAMURA (Tamura) TLF-204-GT01 Solder Paste Features:

Low voids;

Good solderability on various metals;

Good solderability on QFN copper terminals;

Good printability after placement.

Product Specifications

Metal Composition Sn96.5/Ag3/Cu0.5 JIS Z 3282(2006)
Solid Phase Temperature / Liquid Phase Temperature 216℃ / 220℃ DSC
Tin Powder Particle Size 20~38 Laser Diffraction
Viscosity (Pa·s) 165±30 JIS Z 3284(2014)
Thixotropic Index 0.54±0.05 JIS Z 3284(2014)
Flux Content (%) 11.4±0.3 JIS Z 3197(2012)
Flux Type ROL0 IPC J-STD-004B
Hydrochloric Acid Content in Flux (%) 0.0% JIS Z 3197(2012) Potentiometric Titration Method
Insulation Resistance Above 1E+09Ω JIS Z 3284 (2014)
85℃ / 85% 1000h
Copper Plate Corrosion No Corrosion IPC J-STD-004B
40℃ / 90% 96hr
Copper Mirror Test No Penetration 40℃ / 90% 96hr
Room Temperature 24h

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