Tamura Lead-Free Solder Paste

TAMURA

LF-204-301S


Tamura Lead-Free Solder Paste
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  • Tamura Lead-Free Solder Paste

Product Video

Product Overview

Product Features

TAMURA (Tamura) LF-204-301S Solder Paste Features:

Uses fine solder powder of 12μm or smaller;

When precoating, the solder surface has good wettability and uniformity;

This product complies with IPC halogen-free solder paste standards;

Solder paste contains Br < 900 ppm, Cl < 900 ppm, Br + Cl < 1500 ppm;

Flux residues after reflow soldering can be removed with semi-aqueous cleaning solvents;

Suitable for use with general equipment.

Product Specifications

Project LF-204-301S Test Method
Alloy Composition Sn96.5 / Ag3 / Cu0.5 System (Symbol: 204) ICP
Melting Point 216~220℃ DSC
Solder Particle Size 1~12μm Laser Diffraction Method
Flux Content 30.50% JIS Z 3284 (2012)
Viscosity 170Pa.s JIS Z 3284-3 (1994) Malcom PCU Type Viscometer 25℃

Product Advantages

Application Areas

There is a substrate factory with Pre-coat tin plating process, using Solder ball with flux BF-51.

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