BGA Ball Bumping Machine
MEISHO
RBC-100
Product Video
Product Overview
Introduction to MEISHO RBC-100 BGA Ball Placement Machine:
This single tool can complete solder paste printing before component mounting and rework component regeneration. Almost all such work scenarios can achieve high efficiency.
MEISHO RBC-100 offers advantages such as cost reduction, shortened component analysis time, shortened component delivery time, and environmentally friendly regeneration.
The maximum supported size of the RBC-100 has increased from the RBC-1's 50mm rectangle to a 100mm rectangle.
Product Features
Features of MEISHO RBC-100 BGA Ball Placement Machine:
Extremely simple to use and can operate in a short time;
Supports packaging components under 2 millimeters;
Low initial cost and operating expenses;
Standard equipment includes a simple fixing frame to prevent reverse bending of the stencil;
Standard equipment also includes a fixture function to directly move components to repair devices (regardless of manufacturer);
A dedicated heating platform is standard equipment to ensure stable ball placement heating;
Positioning of the stencil and components is also very simple;
Excess solder balls can be easily recovered;
The main unit contains a container for storing recovered solder balls;
Components and solder balls are handled without touching by hand, operable with one button.
Product Specifications
| Package Types | Surface Mount SMD Components BGA/CSP/LGA/QFN/LLP/POP/Others |
| Package Size | 3mm~100mm (can correspond to rectangular standards) |
| Desktop Adjustment Range (Precision) | X·Y·Z axes 0.01 unit / θ axis ±3° (height gauge) |
| Machine Dimensions/Weight | 160W*280D*230H / Main body 3.5kg |
| Air Pressure Supply | 0.5~0.8Mpa |
Note: Product appearance and specifications may change due to product improvements and upgrades.
Product Advantages
Application Areas
Recommended Products
FAQ
Online Message
If you are interested in our products, please leave your email to get a free quotation, thank you!
OUTLETS
Service Outlets
Shanghai-Head Office
Shanghai Hapoin Enterprise Development Co., Ltd.
Address: Building 6, Southern Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
Telephone:+86 150 2686 5822
Email:info@hapoin.com
Shenzhen Branch
Shenzhen Hapoin Ruihe Technology Development Co., Ltd.
Address: Room 302, 3rd Floor, Building B, Kaicheng High-tech Park, Dalang Street, Longhua District, Shenzhen
Telephone:+86 0755 2223 2285
Email:sales@hapoin.com
Hong Kong Branch
HAPOIN ENTERPISE LIMITED
Address: Unit 917A, 9/F., Tower A, New Mandarin Plaza, No. 14 Science Museum Road
Telephone:+00852 61187991
Email:sales@hapoin.com
Vietnam Branch
HAPOIN VIETNAM
Address: 6th Floor, CTM Office Building, No. 139, Zhipiao Road, Zhipiao District, Hanoi, Vietnam
Telephone:+84 398 848 969
Email:sales@hapoin.com
Japan Branch
HAPOIN CO., LTD.
Address: 6th Floor, 2-3-8 Iwamotocho, Chiyoda-ku, Tokyo
Telephone:+81 070 9356 1267
Email:sales@hapoin.com
Kunshan Office
Kunshan Office
Address: 10th Floor, Building B, Modern Plaza, No. 8, Weiye Road, Yushan Town, Kunshan City
Telephone:+86 150 2686 5822
Email:sales@hapoin.com
Taipei Branch
Uniwin Chemical Co.,LTD.
Address: No. 14, Alley 3, Lane 250, Section 2, Huanhe South Road, Taipei 10853
Telephone:+886 02 2336 2202
Email:sales@hapoin.com
Beijing Office
Beijing Office
Address: Room 306, Building 4, Zhongtou Oriental, West Zhihe North, Chaoyang District, Beijing
Telephone:+86 150 2686 5822
Email:sales@hapoin.com
Contact Number
Headquarter Address
6, South Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
Follow the official account
Follow the video account
