Selective Wave Soldering

KOKI TEC

Ultima-MR-M


Selective Wave Soldering
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  • Selective Wave Soldering

Product Video

Product Overview

Product Features

· Integrated equipment enables "small batch, multiple varieties" production (large substrates can also be used);

1. High quality;

2. No need for jigs;

· KOKI TEC selective wave soldering nozzles have multiple alignment functions on the top, selectable according to the size of the solder pad;

· KOKI TEC ULTIMA-MR-M uses an inclined welding device, eliminating the need for "dedicated support plate tools," which can reduce manufacturing costs.

Product Specifications

Specifications ULTIMA-MR-M (Model Name)
Substrate Size (MIN) W50×L50 (mm)
Substrate Size (MAX) W300×L460 (mm) (ULTIMA-MR-M)
W600×L600 (mm) (ULTIMA-MR-XL)
Substrate Thickness 0.8-2.0mm
Component Height Top below 60mm, Bottom below 25mm
Lead Length Below 3mm
Injection Height 900±20mm
Solder Capacity Approx. 16kg
Nitrogen Supply 0.5Mpa 25ltr/min
Power Supply 3-phase 200V 7KVA
Overall Dimensions W1370×L1510×H1135 (mm) (ULTIMA-MR-M)
W1670×L1690×H1135 (mm) (ULTIMA-MR-XL)
Weight Approx. 750kg (including solder) (ULTIMA-MR-M)
Approx. 800kg (including solder) (ULTIMA-MR-XL)

Product Advantages

Application Areas

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