Product Video
Product Overview
Product Features
Features of MEISHO RBC-1 V2.0/RBC-100 Bumping Machine:
1. Extremely simple to use and can operate in a short time.
2. Can handle packaging components smaller than a millimeter.
3. Low initial cost and operating expenses.
4. Standard equipment includes a simple fixing frame to prevent reverse bending of the stencil.
5. Standard equipment also includes a fixture function to directly move components to repair devices (regardless of manufacturer).
6. A dedicated heating stage is standard equipment to ensure stable heating for bumping.
7. Positioning of the stencil and components is also very simple.
8. Excess solder balls can be easily recovered.
9. The main unit contains a container for storing recovered solder balls.
10. Components and solder balls do not need to be touched by hand; operation can be done with one button.
Product Specifications
| Product Specifications | RBC-1 | RBC-100 |
| Package Types | Surface Mount SMD Devices BGA/CSP/LGA/QFN/LLP/POP/Others | |
| Package Size | □3mm～□50mm (Compatible with rectangular standards) | □3mm～□100mm (Compatible with rectangular standards) |
| Adsorption ring below □3mm (Optional accessory available) | ||
| For devices with double-sided bumps and devices above □50mm, please consult technical staff | ||
| Bump pitch (bump center) | 0.3～1.27mm (Usable for pitches above 1.27mm) | |
| Ball φ (diameter) | 0.1～0.76φ (MAX 2.0φ) ※Device thickness varies. Z-axis 0～50mm | |
| Table adjustment range (accuracy) | X, Y, Z axes 0.01 unit / θ axis ±3° (visual inspection) | X, Y, Z axes 0.01 unit / θ axis ±3° (height gauge) |
| Machine dimensions/weight | 120W*240D*150H / Main unit 3.0kg | 160W*280D*230H / Main unit 3.5kg |
| Air pressure supply | 0.5～0.8Mpa | |
Product Advantages
Application Areas
Recommended Products
FAQ
Online Message
If you are interested in our products, please leave your email to get a free quotation, thank you!
OUTLETS
Service Outlets
Shanghai-Head Office
Shanghai Hapoin Enterprise Development Co., Ltd.
Address: Building 6, Southern Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
Telephone:+86 150 2686 5822
Email:info@hapoin.com
Shenzhen Branch
Shenzhen Hapoin Ruihe Technology Development Co., Ltd.
Address: Room 302, 3rd Floor, Building B, Kaicheng High-tech Park, Dalang Street, Longhua District, Shenzhen
Telephone:+86 0755 2223 2285
Email:sales@hapoin.com
Hong Kong Branch
HAPOIN ENTERPISE LIMITED
Address: Unit 917A, 9/F., Tower A, New Mandarin Plaza, No. 14 Science Museum Road
Telephone:+00852 61187991
Email:sales@hapoin.com
Vietnam Branch
HAPOIN VIETNAM
Address: 6th Floor, CTM Office Building, No. 139, Zhipiao Road, Zhipiao District, Hanoi, Vietnam
Telephone:+84 398 848 969
Email:sales@hapoin.com
Japan Branch
HAPOIN CO., LTD.
Address: 6th Floor, 2-3-8 Iwamotocho, Chiyoda-ku, Tokyo
Telephone:+81 070 9356 1267
Email:sales@hapoin.com
Kunshan Office
Kunshan Office
Address: 10th Floor, Building B, Modern Plaza, No. 8, Weiye Road, Yushan Town, Kunshan City
Telephone:+86 150 2686 5822
Email:sales@hapoin.com
Taipei Branch
Uniwin Chemical Co.,LTD.
Address: No. 14, Alley 3, Lane 250, Section 2, Huanhe South Road, Taipei 10853
Telephone:+886 02 2336 2202
Email:sales@hapoin.com
Beijing Office
Beijing Office
Address: Room 306, Building 4, Zhongtou Oriental, West Zhihe North, Chaoyang District, Beijing
Telephone:+86 150 2686 5822
Email:sales@hapoin.com
Contact Number
Headquarter Address
6, South Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
Follow the official account
Follow the video account
