Tamura Lead-free and Halogen-free Solder Paste

TAMURA

TLF-204F-SHK


Tamura Lead-free and Halogen-free Solder Paste
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  • Tamura Lead-free and Halogen-free Solder Paste

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Product Overview

Product Features

TAMURA TLF-204F-SHK Solder Paste Features:

· Uses lead-free (tin/silver/copper) solder alloy;

· Small viscosity change during continuous printing, ensuring stable printing quality;

· Achieves good wettability in fine adjustment mode for CSP;

· No sudden drop during the preheating process;

· Excellent solderability even at high peak temperatures;

· Excellent reliability even without cleaning flux residues.

Product Specifications

Item Characteristics Test Method
Alloy Composition Sn96.5/Ag3.0/Cu0.5 JIS Z 3282(1999)
Melting Point 216~220℃ Measured by DSC
Tin Powder Particle Size 10~30μm Measured by Laser Refraction Method
Tin Powder Shape Spherical JIS Z 3284(1994)
Flux Content 12.2% JIS Z 3284(1994)
Chlorine Content 0.0 % JIS Z 3197(1999)
Viscosity 210 Pa·s JIS Z 3284(1994)
Malcom PCU Type Viscometer 25℃
Aqueous Solution Resistance Test 1×10⁴ Ω·cm or above JIS Z 3197(1999)
Insulation Resistance Test 1×10⁸ Ω or above JIS Z 3284(1994)
Spreadability Test Less than 0.20 mm Print solder paste on a ceramic substrate, heat at 150℃ for 60 seconds, and measure the spread amount from the width before and after heating the solder. STD-092b※
Solder Ball Test Almost no solder balls occurred Print solder paste on a ceramic substrate, melt and heat, then observe with a 50x microscope. STD-009e※
Solder Diffusion Test 75% or more JIS Z 3197(1986)
Copper Plate Corrosion Test No Corrosion JIS Z 3197(1986)
Adhesion Test of Solder Paste Residue after Reflow Pass JIS Z 3284(1994)

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