Tamura Lead-Free Solder Paste

TAMURA

TLF-204-HSP


Tamura Lead-Free Solder Paste
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  • Tamura Lead-Free Solder Paste

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Product Overview

Product Features

TAMURA (Tamura) TLF-204-HSP Solder Paste Features:

Excellent crack resistance to flux residues;

Uses lead-free (tin/silver/copper) solder alloy;

Exhibits excellent insulation properties even under high temperature and high humidity;

Suitable for N2 reflow;

Good printability even on fine pads with 0.3mm pitch.

Product Specifications

Project TLF-204-HSP Test Method
Alloy Composition Tin 96.5 / Silver 3.0 / Copper 0.5 JIS Z 3282 (1999)
Melting Point 216~220 ℃ Detected by DSC
Solder Particle Size 20~36 μm Measured by Laser Light Refraction Method
Tin Powder Shape Spherical JIS Z 3284 (1994)
Flux Content 11.4% JIS Z 3284 (1994)
Halogen Content 0.1% JIS Z 3197 (1999)
Viscosity 200 Pa.s JIS Z 3284 (1994) Appendix 6
Malcom PCU Type Viscometer 25℃

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