High Reliability Lead-Free Solder Paste
TAMURA GP-213-167

TAMURA

GP-213-167


High Reliability Lead-Free Solder Paste<br>TAMURA GP-213-167
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  • High Reliability Lead-Free Solder Paste<br>TAMURA GP-213-167

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Product Overview

Product Features

TAMURA GP-213-167 Solder Paste Features:

Exhibits excellent heat resistance even under high-temperature reflow, with high reliability and trustworthiness; excellent effect in preventing component breakage;

This product is made with lead-free solder alloy (tin/silver/copper), maintaining soldering quality under thermal shock cycling;

Also has excellent insulation properties under high temperature and high humidity;

Suitable for atmospheric reflow.

Product Specifications

Item TLF287-171AT Test Method
Alloy Composition Sn / Ag3.0 / Cu0.7 / Bi4.5 / Sb5.0 System JIS Z 3910(2017)
Melting Point 209~226℃ JIS Z 3198-1(2014)
Solder Particle Size 20~38μm Using Laser Light Refraction Method
Tin Powder Shape Spherical JIS Z 3284-2(2014)
Flux Content 12.0% JIS Z 3197(2012)
Halogen Content Less than 0.05% JIS Z 3197(2012)
Viscosity 200Pa.s JIS Z 3284-3(2014)
Malcom PCU Type Viscometer 25℃

Product Advantages

Application Areas

Automotive electronics, as well as industries with high reliability requirements.

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