BGA Rework Station

MEISHO

MS9000SE


BGA Rework Station
BGA Rework Station
BGA Rework Station
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  • BGA Rework Station
  • BGA Rework Station
  • BGA Rework Station

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Product Overview

Product Features

Features of MEISHO MS9000SE BGA Rework Station:

Higher repair efficiency and success rate can greatly reduce repair costs; 
Four-point automatic alignment technology allows anyone to operate correctly; 
Completely ensures quality issues are addressed; 
Depending on the component assembly method, even without considering the repair or installation of chip components, there is no need to purchase new equipment if necessary, as long as the required parts are available.

Product Specifications

System SpecificationsMS9000SE TPMS9000SE PCMS9000SE (TP/PC) LL
Maximum Substrate Size 
Parentheses indicate the maximum installable substrate size
300×400mm 
(300×400mm)
300×400mm 
(300×400mm)
400×500mm 
(460×600mm)
Target Component Size□1~□50 (0402~Option)□1~□50 (0402~Option)□1~□50 (0402~Option)
Power RequirementsSingle-phase AC 200V~240V approx. 2.5KVA (12.5A)Single-phase AC 200V~240V approx. 2.5KVA (12.5A)Single-phase AC 200V~240V approx. 4.5KVA (22.5A)
Top Heater1040W1040W1040W
Standard Bottom Heater1000W1000W1000W
Wide Bottom HeaterOneOne2000W
Control MethodPLCPLCPLC
Operation Unit (Display Method)Touch Screen 
Optical Unit Output LCD
Windows PC LCDTouch Screen / Optical Unit Output LCD 
Windows PC LCD
Connected ThermometersK-type Thermocouple 1~6 channelsK-type Thermocouple 1~6 channelsK-type Thermocouple 1~6 channels
Temperature Curve Acquisition ModeAutomatic Mode Manual ModeAutomatic Mode Manual ModeAutomatic Mode Manual Mode
System Dimensions1300(W)×700(D)×950(H)mm1050(W)×700(D)×950(H)mm1450(W)×850(D)×950(H)mm

 

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