BGA Rework Station

MEISHO

MS9000SE


BGA Rework Station
BGA Rework Station
BGA Rework Station
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  • BGA Rework Station
  • BGA Rework Station
  • BGA Rework Station

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Product Overview

Product Features

Features of MEISHO MS9000SE BGA Repair Station:

Higher repair efficiency and success rate can greatly reduce repair costs;
Four-point automatic alignment technology allows anyone to operate correctly;
Completely ensures quality issues are addressed;
Depending on the component assembly method, even without considering the repair or installation of chip components, there is no need to purchase new equipment if necessary, as long as the required parts are available.

Product Specifications

System Specifications MS9000SE TP MS9000SE PC MS9000SE (TP/PC) LL
Maximum Substrate Size
Parentheses indicate the maximum installable substrate size
300×400mm
(300×400mm)
300×400mm
(300×400mm)
400×500mm
(460×600mm)
Target Component Size □1~□50 (0402~Option) □1~□50 (0402~Option) □1~□50 (0402~Option)
Power Requirements Single-phase AC 200V~240V approx. 2.5KVA (12.5A) Single-phase AC 200V~240V approx. 2.5KVA (12.5A) Single-phase AC 200V~240V approx. 4.5KVA (22.5A)
Top Heater 1040W1040W1040W
Standard Bottom Heater 1000W1000W1000W
Wide Bottom Heater One One 2000W
Control Method PLC PLC PLC
Operation Unit (Display Method) Touch Screen
Optical Unit Output LCD
Windows PC LCD Touch Screen / Optical Unit Output LCD
Windows PC LCD
Connected Thermometers K-type Thermocouple 1~6 channels K-type Thermocouple 1~6 channels K-type Thermocouple 1~6 channels
Temperature Curve Acquisition Mode Automatic Mode Manual Mode Automatic Mode Manual Mode Automatic Mode Manual Mode
System Dimensions 1300(W)×700(D)×950(H)mm 1050(W)×700(D)×950(H)mm 1450(W)×850(D)×950(H)mm

 

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