Tamura Lead-Free Low-Silver Solder Paste

TAMURA

GP-211-167


Tamura Lead-Free Low-Silver Solder Paste
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  • Tamura Lead-Free Low-Silver Solder Paste

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Product Overview

Product Features

Features of TAMURA GP-211-167 Solder Paste:

· Excellent viscosity stability during continuous use;

· Stable solderability even during continuous use;

· Defect control for BGA and others;

· Can reduce voids under electrode components as well.

Product Specifications

Product Name GP-211-167 Test Method
Alloy Composition 99.0Sn/0.3Ag/0.7Cu 
Melting Point (℃) 217~227 DSC
Viscosity (Pa·s) 200 JIS Z 3284(1994)
Thixotropic Index 0.53 JIS Z 3284(1994)
Flux Content (%) 11.9 JIS Z 3284(1994)
Halogen Content (%) 0.0 JIS Z 3197(1999)
Tin Powder Particle Size (μm) 20~36 Laser Diffraction Method
Insulation Resistance (Ω) Above 1×10^9 JIS Z 3284(1994)
Copper Plate Corrosion No Corrosion JIS Z 3197(1999)
Flux Type ROL0 J-STD 004B

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