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Product Features
TAMURA (田村) TLF-204-171AK Solder Paste Features:
TLF-204-171AK is a no-clean, lead-free solder paste using lead-free (tin/silver/copper) solder alloy;
It is made with spherical solder powder containing minimal oxides and a special flux, resulting in minimal viscosity change over time during continuous printing and stable printing quality;
It has good wettability to components and pads, and effectively improves BGA soldering issues;
TLF-204-171AK can operate at high temperatures and has excellent solderability;
Even without removing the flux residue on the board, it maintains excellent reliability.
Lead-free, which greatly benefits environmental and workplace protection.
Product Specifications
| Project | Features (TLF-204-171AK) | Test Method |
| Alloy Composition | Tin 96.5 / Silver 3.0 / Copper 0.5 | JIS Z 3282 (1999) |
| Melting Point (℃) | 216～220℃ | Measured by DSC |
| Solder Particle Size (μm) | 20~38 μm | Measured by Laser Light Refraction Method |
| Tin Powder Shape | Spherical | JIS Z 3282 (1994) Appendix 1 |
| Flux Content | 11.5% | JIS Z 3284 (1994) |
| Chlorine Content | 0.0% (in flux) | JIS Z 3197 (1999) |
| Viscosity | 170Pa.s | JIS Z 3284 (1994) Malcom PCU Type Viscometer 25℃ |
| Aqueous Solution Resistance Test | 1×10⁴ Ω·cm or above | JIS Z 3197 (1999) |
| Insulation Resistance Test | 1×10⁹ Ω or above | JIS Z 3284 (1994) Appendix 3, Type 2 Substrate Reflow: Heated by Reflow Oven |
| Spreadability Test | 0.20mm or less | Solder paste printed on ceramic substrate, heated at 15 0℃ for 60 seconds, measuring the spread width before and after solder heating. Width used to measure spread amount. STD-092b Note |
| Solder Ball Test | Almost no solder balls formed | Solder paste printed on ceramic substrate, melted and heated, observed under 50x microscope. STD-009e Note |
| Solder Diffusion Test | 75% or more | JIS Z 3197 (1986) |
| Copper Plate Corrosion Test | No corrosion observed | JIS Z 3197 (1986) |
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Shanghai-Head Office
Shanghai Hapoin Enterprise Development Co., Ltd.
Address: Building 6, Southern Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
Telephone:+86 150 2686 5822
Email:info@hapoin.com
Shenzhen Branch
Shenzhen Hapoin Ruihe Technology Development Co., Ltd.
Address: Room 302, 3rd Floor, Building B, Kaicheng High-tech Park, Dalang Street, Longhua District, Shenzhen
Telephone:+86 0755 2223 2285
Email:sales@hapoin.com
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HAPOIN ENTERPISE LIMITED
Address: Unit 917A, 9/F., Tower A, New Mandarin Plaza, No. 14 Science Museum Road
Telephone:+00852 61187991
Email:sales@hapoin.com
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HAPOIN VIETNAM
Address: 6th Floor, CTM Office Building, No. 139, Zhipiao Road, Zhipiao District, Hanoi, Vietnam
Telephone:+84 398 848 969
Email:sales@hapoin.com
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HAPOIN CO., LTD.
Address: 6th Floor, 2-3-8 Iwamotocho, Chiyoda-ku, Tokyo
Telephone:+81 070 9356 1267
Email:sales@hapoin.com
Kunshan Office
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Address: 10th Floor, Building B, Modern Plaza, No. 8, Weiye Road, Yushan Town, Kunshan City
Telephone:+86 150 2686 5822
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Uniwin Chemical Co.,LTD.
Address: No. 14, Alley 3, Lane 250, Section 2, Huanhe South Road, Taipei 10853
Telephone:+886 02 2336 2202
Email:sales@hapoin.com
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Beijing Office
Address: Room 306, Building 4, Zhongtou Oriental, West Zhihe North, Chaoyang District, Beijing
Telephone:+86 150 2686 5822
Email:sales@hapoin.com
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Headquarter Address
6, South Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
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