Product Video
Product Overview
Product Features
TAMURA (Tamura) TLF-204-NH Solder Paste Features:
Uses lead-free (tin/silver/copper) solder alloy;
Uses halogen-free flux;
Viscosity changes little during continuous printing, ensuring stable printing quality;
Exhibits excellent solderability even when reflowed in air;
Has excellent solderability even at high peak temperatures;
NH (20-36) also offers excellent reliability even without cleaning flux residues.
Product Specifications
| Item | Features (TLF-204-NH(20-36)) | Test Method |
| Alloy Composition | Sn96.5/Ag3.0/Cu0.5 | JIS Z 3282(1999) |
| Melting Point (℃) | 216～220℃ | Measured by DSC |
| Solder Particle Size (μm) | 20～36μm | Measured by Laser Diffraction |
| Tin Powder Shape | Spherical | JIS Z 3284(1994) |
| Flux Content | 11.8% | JIS Z 3284(1994) |
| Chlorine Content | 0.0% (in flux) | JIS Z 3197(1999) |
| Viscosity | 180Pa.s | JIS Z 3284(1994) Malcom PCU Viscometer 25℃ |
| Aqueous Solution Resistance Test | Greater than 1×10⁴ Ω·cm | JIS Z 3197(1999) |
| Insulation Resistance Test | Greater than 1×10⁹ Ω | JIS Z 3284(1994) |
| Spread Test | Less than 0.20 mm | Print solder paste on a ceramic substrate, heat at 15 0℃ for 60 seconds, measure the spread width before and after solder heating. Measure the spread width to determine the spread amount. STD-092b Note |
| Solder Ball Test | Almost no solder balls occur | Print solder paste on a ceramic substrate, melt and heat, then observe under 50x microscope. STD-009e Note |
| Solder Diffusion Test | Over 70% | JIS Z 3197(1986) |
| Copper Plate Corrosion Test | No Corrosion | JIS Z 3197(1986) |
| Adhesion Test of Solder Paste Residue after Reflow | Pass | JIS Z 3284(1994) |
Product Advantages
Application Areas
Recommended Products
FAQ
Online Message
If you are interested in our products, please leave your email to get a free quotation, thank you!
OUTLETS
Service Outlets
Shanghai Headquarters
Hapoin Enterprise was
Address: Building 6, Southern Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
Inquiry Hotline:+86 150 2686 5822
Email:info@hapoin.com
Shenzhen Company
Shenzhen Hengpeng Ruihe Technology Co., Ltd.
Address: Room 302, 3rd Floor, Building B, Kaicheng High-tech Park, Dalang Street, Longhua District, Shenzhen
Inquiry Hotline:+86 0755 2223 2285
Email:sales@hapoin.com
Hong Kong Company
HAPOIN ENTERPISE LIMITED
Address: Unit 917A, 9/F., Tower A, New Mandarin Plaza, No. 14 Science Museum Road
Telephone:+00852 61187991
Email:sales@hapoin.com
Vietnam Company
Vietnam Hengpeng Co., Ltd.
Address: 6th Floor, CTM Office Building, No. 139, Zhipiao Road, Zhipiao District, Hanoi, Vietnam
Telephone:+84 243 796 0048
Email:sales@hapoin.com
Japan Company
Japan Hengpeng Co., Ltd.
Address: 6th Floor, 2-3-8 Iwamotocho, Chiyoda-ku, Tokyo
Telephone:+81 070 9356 1267
Email:sales@hapoin.com
Kunshan Operation Center
Shanghai Hengpeng Enterprise - Kunshan Operation Center
Address: 10th Floor, Building B, Modern Plaza, No. 8, Weiye Road, Yushan Town, Kunshan City
Inquiry Hotline:+86 150 2686 5822
Email:sales@hapoin.com
Taipei Company
Lianying Chemical Co., Ltd.
Address: No. 14, Alley 3, Lane 250, Section 2, Huanhe South Road, Taipei 10853
Telephone:+886 02 2336 2202
Email:sales@hapoin.com
Beijing Office
Shanghai Hengpeng Enterprise - Beijing Office
Address: Room 306, Building 4, Zhongtou Oriental, West Zhihe North, Chaoyang District, Beijing
Telephone:+86 150 2686 5822
Email:sales@hapoin.com
Contact Number
Headquarter Address
6, South Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
Follow the official account
Follow the video account
