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Product Overview
LFSOLDER TLF-204F-TNA23K-R is a lead-free solder paste composed of lead-free spherical solder powder and halogen-free flux. This solder paste contains no lead and is halogen-free, thereby making a significant contribution to protecting the Earth's environment. In addition, this flux requires no cleaning and offers excellent reliability.
Product Features
TAMURA LFSOLDER TLF-204F-TNA23K-R Solder Paste Features:
Uses lead-free (Sn/Ag/Cu) solder alloy;
Very little change over time during continuous printing, enabling stable printing;
Halogen-free solder paste using No. 5 solder powder;
Even with long preheating times, solder can melt on small pads;
No cleaning required, with excellent reliability.
Product Specifications
| Item | Features (TLF-204-TNA23K-R) | Test Method |
| Alloy Composition | Sn 96.5 / Ag 3.0 / Cu 0.5 | JIS Z 3282 (2006) |
| Melting Point | 216～220℃ | Determined by DSC |
| Tin Powder Particle Size | 15～25 µm | TAMURA Standard Test Method STD-012h |
| Tin Powder Particle Size | Spherical | JIS Z 3284-2 (2014) |
| Flux Content | 12.3% | JIS Z 3197 (2012) |
| Halogen Content | 0.0% | JIS Z 3197 (2012) |
| Viscosity | 190 Pa·s | JIS Z 3284-3 (2014) MALCOM PCU Type Viscometer 25℃ |
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