Tamura Lead-Free Solder Paste

TAMURA

TLF-204-111A


Tamura Lead-Free Solder Paste
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  • Tamura Lead-Free Solder Paste

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Product Overview

Product Features

TAMURA (Tamura) TLF-204-111A Solder Paste Features:

This product is made of lead-free solder alloy (tin/silver/copper);

Viscosity does not change over time during continuous printing, providing good stability;

Effectively reduces voids;

Lead-free soldering shows good heat resistance even under high-temperature reflow;

Demonstrates good soldering performance on tiny components such as CSP with 0.5mm pitch;

Effectively reduces flux spatter during soldering of gold-plated terminals;

Shows good wettability even on gold-plated pads;

Solder balls around chips are basically not generated.

Product Specifications

Project TLF-204-111A Test Method
Alloy Composition Sn96.5/Ag3.0/Cu0.5 JIS Z 3282 (1999)
Melting Point 216~220 ℃ Detected by DSC
Solder Particle Size 25~40 μm Measured by Laser Light Refraction Method
Flux Content 11.6% JIS Z 3284 (1994)
Halogen Content Less than 0.1% JIS Z 3197 (1999)
Viscosity 215 Pa.s JIS Z 3284 (1994)
Thixotropic Index 0.53 JIS Z 3284 (1994)

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