Tamura Lead-Free Solder Paste

TAMURA

TLF-204-167


Tamura Lead-Free Solder Paste
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  • Tamura Lead-Free Solder Paste

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Product Overview

Product Features

TAMURA TLF-204-167 Solder Paste Features:

This product is made of lead-free solder alloy (tin/silver/copper);

Viscosity does not change over time during continuous printing, providing good stability.

Solder balls around the chip are basically not produced;

Excellent solderability under high-temperature reflow;

Outstanding reliability can be achieved without cleaning flux residues.

Product Specifications

Product Name Characteristics Test Method
Alloy Composition Sn96.5/ Ag3.0/ Cu0.5 JIS Z 3282 (1999)
Melting Point 216~220°C DSC Measurement
Solder Particle Size 20~38μm Laser Analysis
Solder Particle Shape Spherical Annex 1 to JIS Z 3284 (1994)
Flux Content 11.7% JIS Z 3284 (1994)
Halogen Content 0.0% JIS Z 3197 (1999)
Viscosity 200 Pa·s Viscometer Measurement at 25°C

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