Product Video
Product Overview
Introduction to TAMURA TLF-204F-171S Solder Paste:
The TLF-204F-171S solder paste is a no-clean, lead-free solder paste made from spherical solder powder with minimal oxides and a special flux. Since the solder paste contains no lead, it greatly benefits environmental and workplace protection. Additionally, this solder paste maintains excellent reliability even if its residues on the board are not removed.
Product Features
TAMURA (Tamura) TLF-204F-171S Solder Paste Features:
1. Uses lead-free (tin/silver/copper) solder alloy;
2. Small viscosity change during continuous printing, ensuring stable printing quality;
3. Exhibits good wettability on components;
4. Excellent solderability even at high peak temperatures;
5. Excellent reliability even without cleaning flux residues.
Product Specifications
| Project | Characteristics | Test Method |
| Alloy Composition | Tin 96.5 / Silver 3.0 / Copper 0.5 | JIS Z 3282 (1999) |
| Melting Point | 216~220 ℃ | Measured by DSC |
| Tin Powder Particle Size | 10~30 μm | Measured by Laser Light Refraction Method |
| Tin Powder Shape | Spherical | JIS Z 3284 (1994) |
| Flux Content | 12.5% | JIS Z 3284 (1994) |
| Chlorine Content | Below 0.05% | JIS Z 3197 (1999) |
| Viscosity | 210Pa.s | JIS Z 3284 (1994) Malcom PCU Type Viscometer 25℃ |
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Shanghai-Head Office
Shanghai Hapoin Enterprise Development Co., Ltd.
Address: Building 6, Southern Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
Telephone:+86 150 2686 5822
Email:info@hapoin.com
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Address: Room 306, Building 4, Zhongtou Oriental, West Zhihe North, Chaoyang District, Beijing
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Headquarter Address
6, South Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
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