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Product Overview
Product Features
Features of TAMURA TLF-204G-HFW Solder Paste:
1. Uses ultra-fine powder below 15μm;
2. Excellent printability, suitable for 0201 chip mounting patterns;
3. Good wettability for fine apertures;
4. Uses halogen-free flux;
5. Flux residues after soldering can be cleaned with water-based cleaners.
Product Specifications
| Product Name | TLF-204-75 | Test Method |
| Alloy Composition (%) | Sn 96.5 / Ag 3.0 / Cu 0.5 | JISZ3282(2006) |
| Melting Point (℃) | 216-220 | DSC Measurement |
| Solder Particle Size (μm) | 5-15 | Laser Analysis |
| Flux Content (%) | 11.3 | JISZ3197(2012) |
| Halogen Content (%) | 0.0 | JISZ3197(2012) |
| Viscosity (Pa·s) | 190 | JISZ3284-3(2014) |
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Contact Number
Headquarter Address
6, South Metropolis Garden, No. 1165, Jindu Road, Minhang District, Shanghai
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